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Automatic Relations is covered in depth in the Dimensions/Relations toolbar section. Automatic Solve is turned on by default. As you make changes to a sketch by adding relations or changing dimensions, SolidWorks automatically and immediately updates the sketch to reflect the changes. When the Automatic Solve setting is turned off, these changes are deferred until you exit the sketch or turn the Automatic Solve setting back on. The setting can be useful to prevent intermediate solutions (for example, when half of the changes are made) that may cause problems with the sketch, and when you are confident that the outcome will be correct. If you import a large drawing from the DXF or DWG formats, these drawings import as sketch entities into either a SolidWorks sketch or a drawing. SolidWorks may automatically turn off the Automatic Solve setting for performance (speed) reasons on files of this type. Enable Snapping is turned on by default. It enables the cursor to snap to the endpoints of existing sketch entities to help you make cleaner sketches. When you turn this setting off, Automatic Relations is also disabled (although the icon for the setting remains depressed, Automatic Relations are not created).

the top or other edge of the screen by clicking and holding in the title bar area as shown in Figure 4-31. If you maximized or snapped the window using Aero Snaps, it will return to its previous size and position.

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READOUT ELECTRONICS are proportional to the strip length For a small strip pitch the interstrip capacitance dominates Given the large variety of possible geometrical arrangements of strip detectors one can have the detector capacitance in the range from a fraction of pF, for strip lengths of a few millimetres, up to tens of pF for strip lengths of a few centimetres In the rst approximation the leakage current per strip is proportional to the depletion volume corresponding to a given strip and so it is proportional to the strip area The leakage current is, in addition, a strong function of temperature and lowering temperature is a way to reduce the leakage current and the shot noise associated with it Other parameters in Equation (457) are determined by the front-end electronics The rst electronics parameter to be considered is the peaking time.

10 dealt with part configurations and created a good framework for design tables in general. This chapter augments that information with what you need to know to use design tables effectively in assemblies.

One can distinguish two categories of applications with respect to the peaking time, low count rate and high count rate experiments In the rst category we have experiments with such low rate of X-rays that there is practically zero probability of having a pile-up of consecutive pulses regardless of the duration time of pulses in the shaper circuit Another class of applications is constituted by experiments in which the maximum peaking time is limited by the intensity of X-rays For low count rate experiments and for given parameters of the detector and noise parameters of the front-end electronics one can nd an optimum value of the peaking, which yields a minimum value of the ENC.

In practice such an approach leads to reducing all parallel noise sources, including the shot noise of the detector leakage current, as much as possible and shifting the peaking time towards longer values in order to reduce the contributions from the voltage noise sources For a system with current noise reduced to zero, Equation (457) gives in nite peaking time for minimizing the ENC In practice there are always some current noise sources in the detector and in the front-end electronics but for extreme cases one can use peaking time in the range of tens of s In many applications, however, peaking time in the range of a few s is already considered as a long one..

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ItemDrag (Public Instance Event)

Without hesitation I af rm that such a lax method must be strictly prohibited in RF circuit testing. 14.3.3.2 Connection from Ground to Ground Very often there is more than one piece of ground surface in an RF system or block. The connection between ground surfaces may bring about trouble. Figures 14.6 and 14.7 show two types of connections between ground surfaces. In the circuit board of an RF module or RF system, two pieces of ground surfaces are very often connected by a runner as shown in Figure 14.6. If the length of this runner is comparable to the quarter wavelength, the two pieces of the ground surface are not equipotential. Consequently, grounding problems arise. In an RFIC chip, two pieces of ground surfaces are very often connected by a bunch of conductive vias as shown in Figure 14.7. If the diameter of the conductive via is too small, the two ground surfaces may not be equipotential. Consequently, grounding problems may arise.

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